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現在位置首頁>行業專用>行業專用儀器/儀表>專用儀器>晶圓減薄GNX200BP是全自動晶圓研磨機
晶圓減薄GNX200BP是全自動晶圓研磨機
晶圓減薄GNX200BP是全自動晶圓研磨機
  • 晶圓減薄GNX200BP是全自動晶圓研磨機

晶圓減薄GNX200BP是全自動晶圓研磨機

產品報價:詢價

更新時間:2019/11/7 16:58:27

地:廣東

牌:衡鵬

號: GNX200BP

廠商性質: 生產型,

公司名稱: 上海衡鵬企業發展有限公司

產品關鍵詞: 全自動晶圓研磨機   晶圓減薄   GNX200BP  

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晶圓減薄GNX200BP是全自動晶圓研磨機

——又稱晶圓拋光(Wafer Grinding)



GNX200BP晶圓研磨/晶圓減薄概要

GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.



GNX200BP晶圓研磨/晶圓減薄規格

Maximum wafer-machining diameter of wafer 64” or 8”

Grinding Spindle:  Bearing type                 Air bearing, maximum 3600rpm

                   Motor                        2.2kw,4P,high frequency motor 

                   Rapid feed speed             200mm/min

                   Grind feed speed         1 to 999 μm/min 

Grinding wheel size                         ?250 mm

Index Table: Number of work spindles            3 

             Work spindle Bearing type          Mechanical Bearing, or Air Bearing (optional) 

             Speed of Work Spindles         1 to 600 rpm

Automatic Sizing Device:

        Wafer thickness measuring system        2 point contact in-process gauge 

        Wafer minimum setting size              1 μm 

        Wafer size display range         0to 1.2 mm; extended range software available

Table Cleaning Device (Grinder side) Water + Ceramic block

Wafer Cleaning Unit (Grinder side)         Water + brush, and spin/rinse dry station

Number of Cassettes                         2 stations for each unit (Grinder & Polish unit)

Polish head                                     3 Kw AC servo motor for 10 – 460 rpm 

Oscillation speed                               100–8,000 mm/min.

Head Load                                       50 –999 g//cm2 

Pad size                                 200mm O.D.

Polish table speed                              3 Kw AC servo motor for 50 – 200rpm 

Vacuum Chuck material                           Alumina ceramics (dedicate size of wafer)

Chuck cleaning                                 Brush + Water

Wafer cleaning                                 N.C.W + DI water for Polish surface & Air blow spin dry



GNX200BP晶圓研磨/晶圓減薄相關產品:

衡鵬供應

GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding




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